Mechanical reinforcement and thermal conductivity in expanded graphene nanoplatelets reinforced epoxy composites

Subhranshu Chatterjee; J.W. Wang; W.S. Kuo; Nyan‐Hwa Tai; Christoph G. Salzmann; W.L. Li; Rebecca Hollertz; Frank Nüesch; Bryan Chu

doi:10.1016/j.cplett.2012.02.006

JOURNAL ARTICLE

Mechanical reinforcement and thermal conductivity in expanded graphene nanoplatelets reinforced epoxy composites

Subhranshu Chatterjee J.W. Wang W.S. Kuo Nyan‐Hwa Tai Christoph G. Salzmann W.L. Li Rebecca Hollertz Frank Nüesch Bryan Chu

Year: 2012 Journal: Chemical Physics Letters Vol: 531 Pages: 6-10 Publisher: Elsevier BV

DOI: 10.1016/j.cplett.2012.02.006

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Keywords:

Materials science Composite material Epoxy Flexural strength Fracture toughness Flexural modulus Thermal conductivity Graphene Composite number Dynamic mechanical analysis Fourier transform infrared spectroscopy Raman spectroscopy Toughness Polymer Chemical engineering

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Graphene research and applications

Physical Sciences → Materials Science → Materials Chemistry

Tribology and Wear Analysis

Physical Sciences → Engineering → Mechanics of Materials

Thermal properties of materials

Physical Sciences → Materials Science → Materials Chemistry

Mechanical reinforcement and thermal conductivity in expanded graphene nanoplatelets reinforced epoxy composites

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