Structural stability of ultrafine-grained copper

Yujiao Li; Rajeev Kapoor; J.T. Wang; W. Blum

doi:10.1016/j.scriptamat.2007.08.033

ScienceGate Book Chapters

JOURNAL ARTICLE

Structural stability of ultrafine-grained copper

Yujiao Li Rajeev Kapoor J.T. Wang W. Blum

Year: 2007 Journal: Scripta Materialia Vol: 58 (1)Pages: 53-56 Publisher: Elsevier BV

DOI: 10.1016/j.scriptamat.2007.08.033

Get Full-Text PDF Get Analytical Report

Keywords:

Materials science Annealing (glass) Copper Recrystallization (geology) Pressing Metallurgy Flow stress Accumulative roll bonding Severe plastic deformation Homogeneous Composite material Thermodynamics Microstructure

Metrics

Cited By

1.25

FWCI (Field Weighted Citation Impact)

Refs

0.78

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Microstructure and mechanical properties

Physical Sciences → Materials Science → Materials Chemistry

Metallurgy and Material Forming

Physical Sciences → Engineering → Mechanics of Materials

Microstructure and Mechanical Properties of Steels

Physical Sciences → Engineering → Mechanical Engineering

Structural stability of ultrafine-grained copper

Metrics

Citation History

Topics

Related Documents

Thermal stability of ultrafine grained copper

Stability of ultrafine-grained structure of copper under fatigue loading

Vacancies, twins, and the thermal stability of ultrafine-grained copper

Ductility of ultrafine grained copper

Thermal stability of ultrafine-grained copper during high speed micro-extrusion