JOURNAL ARTICLE
Fine pitch copper wire bonding in high volume production
Bernd K. AppeltAndy TsengChun‐Hsiung ChenYi‐Shao Lai
Year: 2010 Journal: Microelectronics Reliability Vol: 51 (1)Pages: 13-20 Publisher: Elsevier BV
Keywords:
Interconnection Wire bonding Intermetallic Copper Reliability (semiconductor) Copper wire Materials science Die (integrated circuit) Volume (thermodynamics) Metallurgy Mechanical engineering Computer science Nanotechnology Electrical engineering Engineering Telecommunications Physics
Metrics
55
Cited By
5.93
FWCI (Field Weighted Citation Impact)
28
Refs
0.97
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Aluminum Alloys Composites Properties
Physical Sciences → Engineering → Mechanical Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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