JOURNAL ARTICLE

Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc

Zhenghao GanYuebin ZhangGuoqing YuCher Ming TanShu Ping LauBeng Kang Tay

Year: 2004 Journal:   Journal of Applied Physics Vol: 95 (7)Pages: 3509-3515   Publisher: American Institute of Physics

Abstract

The mechanical properties—Young’s modulus (E) and hardness (H)—of diamond-like carbon (DLC) thin films deposited on p2+ Si (100) by filtered cathodic vacuum arc with different substrate bias voltage have been studied by nanoindentation measurement, where the substrate effect is included. Their intrinsic properties [including E,H, and yield strength (Y)] without the substrate effect are then derived by finite element analysis. The results show that the intrinsic mechanical properties of the DLC thin films are not affected by the film thickness, but significantly affected by change of sp3 bonding fraction caused by varied substrate bias. An empirical relationship among E, Y, and H for DLC thin films has been built, where E, Y, and H are intrinsic properties of DLC thin films. It is also confirmed that, as an empirical rule, the measured H could be used to represent its intrinsic value when the indentation depth is limited to 10% of the film thickness. However, the measured E with the substrate effect does not observe this empirical rule.

Keywords:
Materials science Nanoindentation Thin film Diamond-like carbon Substrate (aquarium) Vacuum arc Composite material Cathodic arc deposition Diamond Indentation Carbon film Cathodic protection Carbon fibers Nanotechnology Electrode Chemistry Cathode Electrochemistry

Metrics

27
Cited By
1.21
FWCI (Field Weighted Citation Impact)
27
Refs
0.76
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Diamond and Carbon-based Materials Research
Physical Sciences →  Materials Science →  Materials Chemistry
Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
Advanced Surface Polishing Techniques
Physical Sciences →  Engineering →  Biomedical Engineering

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