Precision grinding of binderless ultrafine tungsten carbide (WC) microstructured surfaces

Bing Guo; Qingliang Zhao; Mark J. Jackson

doi:10.1007/s00170-012-4068-5

ScienceGate Book Chapters

JOURNAL ARTICLE

Precision grinding of binderless ultrafine tungsten carbide (WC) microstructured surfaces

Bing Guo Qingliang Zhao Mark J. Jackson

Year: 2012 Journal: The International Journal of Advanced Manufacturing Technology Vol: 64 (5-8)Pages: 727-735 Publisher: Springer Science+Business Media

DOI: 10.1007/s00170-012-4068-5

Get Full-Text PDF Get Analytical Report

Keywords:

Grinding Materials science Tungsten carbide Surface roughness Indentation Composite material Machining Surface finish Enhanced Data Rates for GSM Evolution Surface integrity Metallurgy

Metrics

Cited By

1.76

FWCI (Field Weighted Citation Impact)

Refs

0.84

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Precision grinding of binderless ultrafine tungsten carbide (WC) microstructured surfaces

Metrics

Citation History

Topics

Related Documents

Ultra-precision Grinding of Binderless Tungsten Carbide Aspheric Mold

Ultrasonic Vibration Assisted Grinding of Microstructures on Binderless Tungsten Carbide (WC)

A low temperature nano-lubrication method for enhancing machinability in ultra-precision grinding of binderless tungsten carbide (WC)

Nanosecond Laser Ablation Assisted Precision Grinding of WC/Co Cemented Tungsten Carbide

Ultrafine particle binderless cemented carbide