Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

Tz-Cheng Chiu; Hsun-Chia Lin

doi:10.1007/s10704-009-9348-1

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Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

Tz-Cheng Chiu Hsun-Chia Lin

Year: 2009 Journal: International Journal of Fracture Vol: 156 (1)Pages: 75-96 Publisher: Springer Science+Business Media

DOI: 10.1007/s10704-009-9348-1

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Keywords:

Crack closure Stress intensity factor Crack tip opening displacement Materials science Fracture mechanics Crack growth resistance curve Strain energy release rate Finite element method Structural engineering Composite material Mechanics Engineering

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Mechanical Behavior of Composites

Physical Sciences → Engineering → Mechanics of Materials

Numerical methods in engineering

Physical Sciences → Engineering → Mechanics of Materials

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

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Citation History

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