JOURNAL ARTICLE

Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

Tz-Cheng ChiuHsun-Chia Lin

Year: 2009 Journal:   International Journal of Fracture Vol: 156 (1)Pages: 75-96   Publisher: Springer Science+Business Media
Keywords:
Crack closure Stress intensity factor Crack tip opening displacement Materials science Fracture mechanics Crack growth resistance curve Strain energy release rate Finite element method Structural engineering Composite material Mechanics Engineering

Metrics

42
Cited By
1.96
FWCI (Field Weighted Citation Impact)
38
Refs
0.85
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Mechanical Behavior of Composites
Physical Sciences →  Engineering →  Mechanics of Materials
Numerical methods in engineering
Physical Sciences →  Engineering →  Mechanics of Materials
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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