Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

Tsung-Lin Chou; Chen-Hung Chu; Chun‐Te Lin; Kuo‐Ning Chiang

doi:10.1016/j.sna.2009.03.007

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Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

Tsung-Lin Chou Chen-Hung Chu Chun‐Te Lin Kuo‐Ning Chiang

Year: 2009 Journal: Sensors and Actuators A Physical Vol: 152 (1)Pages: 29-38 Publisher: Elsevier BV

DOI: 10.1016/j.sna.2009.03.007

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Keywords:

Sensitivity (control systems) Pressure sensor Piezoresistive effect Finite element method Microelectromechanical systems Materials science Silicon Silicone Electronic engineering Mechanical engineering Composite material Engineering Structural engineering Optoelectronics

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Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Mechanical and Optical Resonators

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

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