Richard S. LytelEdward S. BinkleyDexter G. GirtonJohn T. KenneyG. F. LipscombAnthony J. TicknorT. E. Van Eck
Electro-optic polymers exhibit many useful properties for distribution and routing of light on optical multilayer boards and modules. With the development of more robust materials it should soon be possible to use these materials to provide high-density interconnects at significant power savings and with reduced noise at frequencies above 100 MHz. We review the research toward creating new materials and devices for applications to packaging technology.
Richard S. LytelG. F. LipscombEdward S. BinkleyJohn T. KenneyAnthony J. Ticknor
Richard S. LytelG. F. LipscombJohn T. KenneyAnthony J. Ticknor
G. F. LipscombRichard S. LytelSusan ErmerJ. F. ValleyT. E. Van EckDexter G. GirtonAnthony J. Ticknor
David WelkerJeff A. TostenrudeDennis W. GarveyBrian K. CanfieldMark G. Kuzyk
Richard S. LytelG. F. LipscombAnthony J. Ticknor