Fabrication of Copper Ferrite Thin Films from Aqueous Solution by the Liquid-phase Deposition Method

Abstract

Abstract Liquid-phase deposition, LPD, method was used for the fabrication of copper ferrite (CuFe2O4) thin film from aqueous solution system of FeOOH–NH4·HF (aq.) and Cu source (Cu(NO3)2 or CuCl2) with H3BO3. SEM observation revealed that highly homogeneous thin film was formed on a substrate. In X-ray diffraction measurements, major peaks assigned to CuFe2O4 was observed in heat-treated films. Quantitative analysis of elements in the deposited films indicated the deposition of CuFe2O4. The kinds of Cu-source did not affect on the deposition. Initial content of Cu2+ could alter the Fe/Cu atomic ratio in deposited film.