LF55GN photosensitive flexopolymer as a new material for ultra-thick and high aspect-ratio MEMS fabrication

Abstract

We present the photosensitive flexopolymer LF55GN as a new material for the realisation of thick three-dimensional microstructures. The latter can be realised with a thickness up to 4 millimetres and with an aspect ratio of 10 using only a single UV exposure step. LF55GN is a unique material that allows fabricating thick components of optical quality that easily absorb stress due to the elastic nature of the material.