Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining

Dinesh Rakwal; Sumet Heamawatanachai; Prashant Tathireddy; Florian Solzbacher; Eberhard Bamberg

doi:10.1007/s00542-009-0792-7

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Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining

Dinesh Rakwal Sumet Heamawatanachai Prashant Tathireddy Florian Solzbacher Eberhard Bamberg

Year: 2009 Journal: Microsystem Technologies Vol: 15 (5)Pages: 789-797 Publisher: Springer Science+Business Media

DOI: 10.1007/s00542-009-0792-7

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Keywords:

Materials science Fabrication Electrode Electrical discharge machining Wafer Machining Microelectrode Silicon Aspect ratio (aeronautics) Capacitance Etching (microfabrication) Optoelectronics Composite material Layer (electronics) Metallurgy

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Advanced Machining and Optimization Techniques

Physical Sciences → Engineering → Electrical and Electronic Engineering

Neuroscience and Neural Engineering

Life Sciences → Neuroscience → Cellular and Molecular Neuroscience

Advanced machining processes and optimization

Physical Sciences → Engineering → Mechanical Engineering

Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining

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