JOURNAL ARTICLE

Molecular dynamics simulations of Kapitza length for argon-silicon and water-silicon interfaces

An T. PhamMurat BarışıkBoHung Kim

Year: 2014 Journal:   International Journal of Precision Engineering and Manufacturing Vol: 15 (2)Pages: 323-329   Publisher: Springer Science+Business Media
Keywords:
Thermal conduction Materials science Silicon Molecular dynamics Thermal resistance Thermal conductivity Interfacial thermal resistance Thermal Computer cooling Nanoscopic scale Length scale Nanotechnology Mechanics Thermodynamics Composite material Mechanical engineering Chemistry Thermal management of electronic devices and systems Optoelectronics Physics

Metrics

51
Cited By
1.39
FWCI (Field Weighted Citation Impact)
26
Refs
0.80
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Thermal properties of materials
Physical Sciences →  Materials Science →  Materials Chemistry
Thermal Radiation and Cooling Technologies
Physical Sciences →  Engineering →  Civil and Structural Engineering
Advanced Thermoelectric Materials and Devices
Physical Sciences →  Materials Science →  Materials Chemistry

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