Functional degradation of NiZnCu-based multilayer chip inductors during nickel electroplating

Jiang Cao; Xiao Hui Wang; Li Zhang; Long Tu Li

doi:10.1016/s0167-577x(02)00797-8

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Functional degradation of NiZnCu-based multilayer chip inductors during nickel electroplating

Jiang Cao Xiao Hui Wang Li Zhang Long Tu Li

Year: 2002 Journal: Materials Letters Vol: 57 (2)Pages: 386-391 Publisher: Elsevier BV

DOI: 10.1016/s0167-577x(02)00797-8

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Keywords:

Materials science Electroplating Degradation (telecommunications) Nickel Inductor Metallurgy Chip Optoelectronics Nanotechnology Electronic engineering Electrical engineering Layer (electronics)

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Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Semiconductor materials and interfaces

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

Functional degradation of NiZnCu-based multilayer chip inductors during nickel electroplating

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