Low-temperature densification and excellent thermal properties of W–Cu thermal-management composites prepared from copper-coated tungsten powders

Lianmeng Zhang; Wenshu Chen; Guoqiang Luo; Pingan Chen; Qiang Shen; Chuanbin Wang

doi:10.1016/j.jallcom.2013.11.003

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Low-temperature densification and excellent thermal properties of W–Cu thermal-management composites prepared from copper-coated tungsten powders

Lianmeng Zhang Wenshu Chen Guoqiang Luo Pingan Chen Qiang Shen Chuanbin Wang

Year: 2013 Journal: Journal of Alloys and Compounds Vol: 588 Pages: 49-52 Publisher: Elsevier BV

DOI: 10.1016/j.jallcom.2013.11.003

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Keywords:

Materials science Sintering Tungsten Copper Composite material Microstructure Thermal expansion Relative density Thermal conductivity Thermal Metallurgy

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Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Fusion materials and technologies

Physical Sciences → Materials Science → Materials Chemistry

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Low-temperature densification and excellent thermal properties of W–Cu thermal-management composites prepared from copper-coated tungsten powders

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