Hideo NamatsuS. HoriguchiYasuo TakahashiMasao NagaseKenji Kurihara
In this article, we demonstrate a technique for fabricating SiO 2 /two-dimensional (2D)-Si/SiO 2 double barrier diodes and discuss their characteristics. Vertical 2D-Si with {111} side planes is formed by orientation-dependent etching of {110} Si using aqueous alkaline solution. The linewidth of the 2D-Si is reduced to nanometer order with NH 4 F/H 2 O 2 solution. This solution also removes the residue generated on Si planes etched by aqueous alkaline solution. Using a skillful arrangement of dummy patterns and an etchback technique, poly-Si electrodes are successfully formed without any lithographic alignments. A SiO 2 /2D-Si/SiO 2 diode fabricated by this process shows resonant characteristics that are in agreement with the calculated values.
Panos PhotopoulosA. G. Nassiopoulou
G. G. QinYingyu ChenG. Z. RanB R ZhangShuzhong WangG. QinZ CW. H. ZongShang-Yuan Ren
А. П. БарабанП. П. КоноровS.A. BotaJ.R. Morante
Mika PrunnilaJouni AhopeltoH. Sakaki