JOURNAL ARTICLE

Research on Carbon Fiber Reinforced C/Cu Composites

Xu RanRun Hong LiuDong Dong Zhang

Year: 2012 Journal:   Advanced materials research Vol: 472-475 Pages: 843-846   Publisher: Trans Tech Publications

Abstract

Through to the research of technological parameter of copper plating on the surface CF, determining the best parameters: electroplating current is 200 mA, electroplating time is 1 h. Using vacuum hot-pressing sintering to make different composition sample, the sample organization been done the SEM microscopic analysis, and measured micro-hardness and density. Then doing comparative analysis. In the matrix, CF was found to be homogeneously dispersed into the metal matrix, increasing the density of the sample.

Keywords:
Materials science Electroplating Plating (geology) Sintering Composite material Copper Matrix (chemical analysis) Metallurgy Pressing Current density Fiber Layer (electronics)

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Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Mechanical Behavior of Composites
Physical Sciences →  Engineering →  Mechanics of Materials

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