A novel method to prepare Cu@Ag core–shell nanoparticles for printed flexible electronics

Chang Kyu Kim; Gyoung-Ja Lee; Min‐Ku Lee; Chang Kyu Rhee

doi:10.1016/j.powtec.2014.04.064

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JOURNAL ARTICLE

A novel method to prepare Cu@Ag core–shell nanoparticles for printed flexible electronics

Chang Kyu Kim Gyoung-Ja Lee Min‐Ku Lee Chang Kyu Rhee

Year: 2014 Journal: Powder Technology Vol: 263 Pages: 1-6 Publisher: Elsevier BV

DOI: 10.1016/j.powtec.2014.04.064

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Keywords:

Nanoparticle Materials science Ethylene glycol Polyimide Scanning electron microscope Transmission electron microscopy Chemical engineering Electrical resistivity and conductivity Copper Electrochemistry Evaporation Nanotechnology Coating Composite material Layer (electronics) Electrode Metallurgy Chemistry Physical chemistry

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Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

A novel method to prepare Cu@Ag core–shell nanoparticles for printed flexible electronics

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