Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment

Yong Kong; Jianqun Shao; Wenchang Wang; Qifa Liu; Zhidong Chen

doi:10.1016/j.jallcom.2008.09.074

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Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment

Yong Kong Jianqun Shao Wenchang Wang Qifa Liu Zhidong Chen

Year: 2008 Journal: Journal of Alloys and Compounds Vol: 477 (1-2)Pages: 328-332 Publisher: Elsevier BV

DOI: 10.1016/j.jallcom.2008.09.074

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Keywords:

Sodium hypophosphite Plating (geology) Hypophosphite Alloy Thiourea Copper plating Materials science Metallurgy Reducing agent Layer (electronics) Corrosion Electroless plating Chemistry Inorganic chemistry Electroplating Composite material

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Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Corrosion Behavior and Inhibition

Physical Sciences → Materials Science → Materials Chemistry

Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment

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