Polyimide-based intracortical neural implant with improved structural stiffness

Abstract

A novel structure for chronically implantable cortical electrodes using polyimide bio-polymer was devised, which provides both flexibility for micro-motion compliance between brain tissues and the skull and at the brain/implant interface and stiffness for better surgical handling. A 5–10 µm thick silicon backbone layer was attached to the tip of the electrode to enhance the structural stiffness. This stiff segment was then followed by a 1 mm flexible segment without a silicon backbone layer. The fabricated implants have tri-shanks with five recording sites (20 µm × 20 µm) and two vias of 40 µm × 40 µm on each shank. In vitro cytotoxicity tests of prototype implants revealed no adverse toxic effects on cells. Bench test impedance values were assessed, resulting in an average impedance value of ∼2 MΩ at 1 KHz. For a 5 µm thick silicon backbone electrode, the stiffness of polyimide-based electrodes was increased ten times over that of electrodes without the silicon backbone layer. Furthermore, polyimide-based electrodes with 5 µm and 10 µm thick silicon backbone layer penetrated pia of rat brain without buckling that has been observed in implants without silicon reinforcement.