Pool boiling heat transfer enhancement with copper nanowire arrays

Bo Shi; Yibiao Wang; Kai Chen

doi:10.1016/j.applthermaleng.2014.09.040

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Pool boiling heat transfer enhancement with copper nanowire arrays

Bo Shi Yibiao Wang Kai Chen

Year: 2014 Journal: Applied Thermal Engineering Vol: 75 Pages: 115-121 Publisher: Elsevier BV

DOI: 10.1016/j.applthermaleng.2014.09.040

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Keywords:

Copper Nanowire Materials science Boiling Nucleate boiling Critical heat flux Nucleation Wetting Electroplating Heat transfer Heat transfer coefficient Heat transfer enhancement Heat flux Boiling heat transfer Composite material Chemical engineering Nanotechnology Thermodynamics Metallurgy Layer (electronics)

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130

Cited By

5.28

FWCI (Field Weighted Citation Impact)

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0.95

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Heat Transfer and Boiling Studies

Physical Sciences → Engineering → Mechanical Engineering

Heat Transfer and Optimization

Physical Sciences → Engineering → Mechanical Engineering

Fluid Dynamics and Thin Films

Physical Sciences → Engineering → Computational Mechanics

Pool boiling heat transfer enhancement with copper nanowire arrays

Metrics

Citation History

Topics

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