JOURNAL ARTICLE

Electrical Characteristics and Reliability of Pt/Ti/Pt/Au Ohmic Contacts to p-Type GaAs

Hiroyuki OkadaShin-ichi Shikata Shin-ichi ShikataHideki Hayashi

Year: 1991 Journal:   Japanese Journal of Applied Physics Vol: 30 (4A)Pages: L558-L558   Publisher: Institute of Physics

Abstract

The ohmic contacts to p-type GaAs formed by GaAs/Pt/Ti/Pt/Au systems were investigated. The specific contact resistance below 8×10 -7 Ω·cm 2 was achieved when the interface Pt between GaAs and Ti/Pt/Au was thicker than 50 Å, which is about one-fourth of the conventional Ti/Pt/Au contact. The activation energies of the initial degradation of the Pt/Ti/Pt/Au electrodes correspond to the reaction of GaAs and Pt to form PtAs 2 . However, even after the initial degradation, Pt/Ti/Pt/Au with the thin Pt interface layer still shows lower contact resistivity. These systems are promising for practical p-tye ohmic contacts for AlGaAs/GaAs heterojunction bipolar transistors.

Keywords:
Ohmic contact Materials science Contact resistance Heterojunction Electrical resistivity and conductivity Layer (electronics) Optoelectronics Platinum Electrode Bipolar junction transistor Degradation (telecommunications) Transistor Chemistry Nanotechnology Electrical engineering Voltage Catalysis Physical chemistry

Metrics

43
Cited By
1.05
FWCI (Field Weighted Citation Impact)
18
Refs
0.73
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Semiconductor materials and interfaces
Physical Sciences →  Physics and Astronomy →  Atomic and Molecular Physics, and Optics
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Integrated Circuits and Semiconductor Failure Analysis
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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