BOOK-CHAPTER
Anisotropic conductive adhesives in electronics
Year: 2011 Elsevier eBooks Pages: 53-104 Publisher: Elsevier BV
Keywords:
Adhesive Interconnection Electrical conductor Materials science Electronics Anisotropy Ball grid array Mechanical engineering Seal (emblem) Electrically conductive Grid Composite material Engineering physics Electrical engineering Engineering Soldering Optics Physics Telecommunications Geology
Metrics
4
Cited By
0.00
FWCI (Field Weighted Citation Impact)
47
Refs
0.12
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Adhesion, Friction, and Surface Interactions
Physical Sciences → Engineering → Mechanics of Materials
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JOURNAL ARTICLE
Reliability aspects of electronics packaging technology using anisotropic conductive adhesives
Journal: Journal of Shanghai University (English Edition) Year: 2007 Vol: 11 (1)Pages: 1-16