JOURNAL ARTICLE
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
Chien-Min LiuHan-wen LinYi-Sa HuangYi‐Cheng ChuChih ChenDian-Rong LyuKuan‐Neng ChenK. N. Tu
Year: 2015 Journal: Scientific Reports Vol: 5 (1)Pages: 9734-9734 Publisher: Nature Portfolio
Keywords:
Copper Creep Materials science Metallurgy Direct bonding Silicon
Metrics
234
Cited By
5.18
FWCI (Field Weighted Citation Impact)
21
Refs
0.97
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
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