JOURNAL ARTICLE

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Keywords:
Copper Creep Materials science Metallurgy Direct bonding Silicon

Metrics

234
Cited By
5.18
FWCI (Field Weighted Citation Impact)
21
Refs
0.97
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
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