Facile synthesis of elliptical Cu-Ag nanoplates for electrically conductive adhesives

Abstract

Elliptical Cu-Ag alloy nanoplates were facile prepared through the in situ substitutional reaction between the as-prepared copper microsized particles and silver ions. The highly purified and uniform Cu-Ag alloy nanoplates, which present a size of 700*500*70 nm, were used as filler to prepare the conductive adhesive in epoxy resin system. After heat-treatment at 170 °C for 60 min, the resistivity of the conductive films is 7.7×10 ^-4 Ω·cm, which is about the same level as commercial conductive adhesives.