Thermal conductivity measurements of epoxy systems at low temperature

Abstract

We have developed a specific thermal conductivity measurement facility for solid materials at low temperature (LHe and LN2). At present, the Measurement of Thermal Conductivity of Insulators (MECTI) facility performs measurements on epoxy resin, as well as on bulk materials such as aluminum alloy and on insulators developed at Saclay. Thermal conductivity measurements on pre-impregnated fiber-glass epoxy composite are presented in the temperature range of 4.2 K to 14 K for different thicknesses in order to extract the thermal boundary resistance. We also present results obtained on four different bonding glues (Stycast 2850 FT, Poxycomet F, DP190, Eccobond 285) in the temperature range of 4.2 K to 10 K.