Micromachining of SiC by femtosecond laser ablation

Naoko Aoki; Koji Sugioka; Kotaro Obata; Toshimitsu Akane; T. Takahashi; S.H. Cho; Hiroshi Kumagai; K. Toyoda; K. Midorikawa

doi:10.1109/cleopr.2001.970944

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Micromachining of SiC by femtosecond laser ablation

Naoko Aoki Koji Sugioka Kotaro Obata Toshimitsu Akane T. Takahashi S.H. Cho Hiroshi Kumagai K. Toyoda K. Midorikawa

Year: 2002 Vol: 2 Pages: II-286

DOI: 10.1109/cleopr.2001.970944

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Abstract

High-speed etching of single-crystal 6H-SiC by femtosecond Ti:sapphire laser ablation was demonstrated. Fine line pattern of 60 /spl mu/m in depth was fabricated with relatively smooth etched surface with little damage.

Keywords:

Materials science Surface micromachining Sapphire Femtosecond Ablation Laser ablation Etching (microfabrication) Laser X-ray laser Silicon carbide Optoelectronics Laser beam machining Optics Laser beams Composite material Fabrication Laser power scaling

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Topics

Diamond and Carbon-based Materials Research

Physical Sciences → Materials Science → Materials Chemistry

Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Laser Material Processing Techniques

Physical Sciences → Engineering → Computational Mechanics

Micromachining of SiC by femtosecond laser ablation

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