Heat dissipation for high power optically pumped semiconductor vertical external cavity surface emitting lasers

Li Fan; Marc Schillgalies; Mahmoud Fallahi; Thomas R. Nelson; J. E. Ehret; Donald L. Agresta; Jerome V. Moloney; J. Hader; Aramais R. Zakharian

doi:10.1109/leos.2003.1251609

JOURNAL ARTICLE

Heat dissipation for high power optically pumped semiconductor vertical external cavity surface emitting lasers

Li Fan Marc Schillgalies Mahmoud Fallahi Thomas R. Nelson J. E. Ehret Donald L. Agresta Jerome V. Moloney J. Hader Aramais R. Zakharian

Year: 2004 Vol: 1 Pages: 79-80

DOI: 10.1109/leos.2003.1251609

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Abstract

This paper investigates several methods for substrate removal and sample mounting. In comparing mounting methods and processing techniques, it is found that indium solder used in conjunction with substrate removal is effective for heat extraction from VECSELs material. Future use of CVD diamond should improve heat transfer due to its superior thermal conductivity.

Keywords:

Materials science Optoelectronics Indium Thermal conductivity Thermal management of electronic devices and systems Semiconductor laser theory Laser Substrate (aquarium) Semiconductor Dissipation Diamond Heat transfer Soldering Heat spreader Heat sink Optics Composite material Electrical engineering Mechanical engineering

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Semiconductor Lasers and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Photonic and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Molecular Junctions and Nanostructures

Physical Sciences → Engineering → Electrical and Electronic Engineering

Heat dissipation for high power optically pumped semiconductor vertical external cavity surface emitting lasers

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