Embedded capacitors technology in printed circuit boards

Abstract

All electronic systems are subjected to change; that be the trend of multitasking technologies, reducing costs, making technology smaller and more efficient. Accordingly passive devices need to be embedded in printed circuit boards by using high density interconnection (HDI) technology to fit current products. Categories of passive device include capacitors, resistors and inductors. Among which capacitors cover the largest area in all kinds of electronic products. For this reason, capacitors should be the first one to be embedded in circuit boards. The development of embedded capacitors should be divided into three parts: material, manufacturing process, and circuitry design. The materials of embedded capacitors must have high dielectric constant (Dk), low dissipation factor (Df) and have to be compatible with PCB manufacturing processes. PCB manufacturers should adjust their process parameters to embed capacitors smoothly and establish an electric library for designers. Eventually, designers can construct a circuitry which uses embedded passive devices from all the library data. According to the procedures, HannStarBoard developed embedded capacitor technology with ITRI Electronics and Opto-electronics Research Laboratories and Materials Research Laboratories (MRL) which introduces enquiries in this report.